
An engineer’s life would be so much easier if perfect energy conversion were possible. However, our world is full of losses. Servers, network architecture and solar inverters get hot. Their power dissipation (Pv) is converted into heat output of equal size, which raises the temperature of the air supplied for cooling (∆T). If the components are just cooled with air, for example, it is only necessary to know the specific thermal capacity of the air (cp) and its density (ϱ) in order to calculate the air flow (V̇) the fans must produce to ensure that the air is kept within the maximum permissible heating limits.
However, as a rule, this calculation is just a first approximation that is followed by more complex modeling and thermal simulation. Alongside the specific geometry of the installation site, factors include the heat transfer resistance of all the materials involved, such as the components, assemblies, the interior air, housings and the exterior air. In the case of solids, consistent simulations are relatively easy to achieve if the mass and heat transfer resistance of the individual materials — such as copper and plastics — are known.

ebm-papst in datacenters
From a structural point of view, no two data centers are alike. That’s why with ebm‑papst there is not just one, but a variety of good solutions.
However, it can be tricky to determine the resistance of component contacts, i.e., at the transition between the individual components of an assembly. Factors such as surface roughness, air bubbles trapped in the adhesive, or gaps play a role here. However, the biggest challenge in thermal insulation is always the transfer of heat from the surfaces of solids to the air and vice versa. In specific construction situations, many surfaces are often arranged consecutively. Exact simulations are important because a difference in temperature of just one or two Kelvin can have a significant impact on the service life of electronic components.

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